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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
SPRINGER 19.11.2013 - 2013Nar: - 6.66 MB PDesc:Sofort lieferbar - Sofort lieferbarThis book describes innovative techniques to address the testing needs of 3D stacked integrated c...
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Springer Verlag GmbH 23.08.2016 - 2016Nar: - PDesc:Print on Demand - Print on Demand - Lieferbar innerhalb von 3-5 WerktagenThis book describes innovative techniques to address the testing needs of 3D stacked integrated c...
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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs
Springer Verlag GmbH 02.12.2013 - 2013Nar: - PDesc:Print on Demand - Print on Demand - Lieferbar innerhalb von 3-5 WerktagenThis book describes innovative techniques to address the testing needs of 3D stacked integrated c...
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